Date of Award

2016-01-01

Degree Name

Master of Science

Department

Computational Science

Advisor(s)

Dr. Raymond C. Rumpf

Abstract

3D printing, or additive manufacturing, is rapidly evolving into a mainstream manufacturing technology that is creating new opportunities for electromagnetics and circuits. 3D printing permits circuits to fully utilize the third dimension allowing more functions in the same amount of space and allows the devices to have arbitrary form factors. 3D printing is letting us discover new physics that is not possible in standard 2D circuits and devices. However, evolving electromagnetics and circuits into three dimensions introduces some serious problems like thermal management, interference, and mutual coupling between the components which degrades performance and hurts signal integrity.

Metamaterials are engineered composites that exhibit extreme electromagnetic properties and allow extraordinary control over electromagnetic fields. The EM Lab is developing spatially-variant anisotropic metamaterials (SVAMs) as a solution to mitigate mutual coupling between components. The concept of SVAMs is to electrically stretch the space between components to reduce mutual coupling. To do this, alternating layers of different dielectric must bisect adjacent components. However, the overall dielectric fill must also conform around dozens of electrical components and be smooth, continuous, and defect free. The research described here is the first prototype of an algorithm which generates a SVAM infill between all of the electrical components of a circuit in order to reduce the mutual coupling.

Language

en

Provenance

Received from ProQuest

File Size

52 pages

File Format

application/pdf

Rights Holder

Asad Ullah Hil Gulib

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