Date of Award
2016-01-01
Degree Name
Master of Science
Department
Electrical Engineering
Advisor(s)
Eric W. MacDonald
Abstract
Additive manufacturing (AM) started over thirty years ago and with it a manufacturing revolution that moves industrial production into the personal home. With recent interest shifting into multi-functional parts fabricated through AM technologies, unified systems are being developed. Merging different manufacturing technologies into one single machine is a challenge but undergoing research has shown promise in the development of multi-functional systems. Concurrent work is being done in the software, automation, and hardware aspect of multi-functional systems. An effort to use industry compatible Computer Aided Design (CAD) software to design multi-functional parts including circuits, micro-machining, and foil embedding then exporting and processing automatically to create a hybrid g-code file is being done. The multi-functional g-code files include all the necessary information to create AM multi-functional parts without human intervention in the unified systems.
One advantage of AM is the ability to quickly prototype, extending this advantage to multi-functional parts means that quick multi-functional prototypes can be produce. Modern AM process are also capable of producing end use parts that are ready for commercial use, this leads to the possibility of creating end user parts with multi-functionality. This Thesis explores the challenges and approaches to developing software that interfaces and processes multi-functional CADs and creates files for direct use in multi-functional AM machines.
Language
en
Provenance
Received from ProQuest
Copyright Date
2016
File Size
97 pages
File Format
application/pdf
Rights Holder
Efrain Aguilera Jr
Recommended Citation
Aguilera Jr, Efrain, "Creating Multi-Functional G-Code For Multi-Process Additive Manufacturing" (2016). Open Access Theses & Dissertations. 590.
https://scholarworks.utep.edu/open_etd/590
Included in
Computer Sciences Commons, Electrical and Electronics Commons, Mechanical Engineering Commons