Metal Additive Microfabrication of Semiconductor Packages With Inbuilt Thermal Management System
Abstract
Moore’s law describes the development capabilities in electronics manufacturing. Although his estimation held for decades, at present, the doubling of components every two years seems to be approaching a halt. The assessment was based on the miniaturization of transistors to create space for more. Miniaturization led to higher component density, decreased cost, lowered power consumption, and compactness. However, it also came with high current density, increased Joule heating, and reduced critical charge. One of the limiting factors is the heat generated from such devices, which is heavily discussed in International Roadmap for Devices and Systems (IRDS) and International Technology Roadmap for Semiconductors (ITRS). Both the roadmaps have called for appropriate solutions and proposed heterogeneous integration of System in Package (SiP) to be one approach to help solve the problem. The proposal has also led to the formation of the Heterogeneous Integration Roadmap (HIR), which has proposed different solutions for developing the semiconductor industry. ITRS defines “Heterogeneous Integration refers to the integration of separately manufactured components into a higher-level assembly (System in Package – SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics.” One of the possibilities would be the use of additive manufacturing for the heterogeneous integration of assistive devices, for which this field has been heavily explored recently. In this dissertation, metal additive manufacturing, and mostly metal microfabrication, has been researched to study the possibilities of heterogeneous integration. This dissertation will present the metal additive microfabricated SiPs demonstrated by quad flat no-lead (QFN) packages with an integrated microfluidic and pin-fin thermal management system for semiconductor devices. This metal additive microfabrication for microsystems is also compared with the conventional cleanroom processes.
Subject Area
Electrical engineering|Computer Engineering|Thermodynamics
Recommended Citation
Lohani, Bhushan, "Metal Additive Microfabrication of Semiconductor Packages With Inbuilt Thermal Management System" (2023). ETD Collection for University of Texas, El Paso. AAI30633958.
https://scholarworks.utep.edu/dissertations/AAI30633958